User’s dilemma: Case
We encountered such issues as burdensome defoaming process, voids, and changes in material properties
Silver paste is used in the manufacture of printed circuit boards.
Silver paste needs to be mixed sufficiently before use because the silver particles sediment easily. Moreover, to maintain the printing quality of silver paste, it is necessary to prevent as many air bubbles as possible from forming during the manufacturing process. Therefore, we used to defoam the material by vacuum decompression for about 30 minutes after manual mixing.
However, voids were formed when the defoamed material was used in the manufacture of printed circuit boards. Our investigation revealed that most solvents contained in the material vaporized during defoaming by vacuum decompression. Since then, we have been looking for a defoaming method that does not change material properties.